HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
4.063MB (4.063M x 8)
Peripherals:
Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Operating Temperature:
-40°C ~ 125°C (TA)
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Package / Case:
176-LQFP Exposed Pad
RAM Size:
768K x 8
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART
Package:
Tray
EEPROM Size:
256K x 8
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of I/O:
148
standardLeadTime:
16 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Dual-Core
Mounting Type:
Surface Mount
Series:
XMC7000
Supplier Device Package:
176-TEQFP (24x24)
Data Converters:
A/D 64x12b SAR
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Speed:
100MHz, 250MHz
ECCN:
5A992C
