NXP USA Inc. LPC55S06JBD64E

LPC55S06JBD64E NXP USA Inc.
LPC55S06JBD64E
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
256KB (256K x 8)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Package / Case:
64-TQFP Exposed Pad
RAM Size:
96K x 8
Data Converters:
A/D 9x16b SAR
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
edacadModel:
LPC55S06JBD64E Models
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
edacadModelUrl:
/en/models/13557460
EEPROM Size:
-
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Qualification:
-
Number of I/O:
45
standardLeadTime:
13 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Single-Core
Mounting Type:
Surface Mount
Grade:
-
Series:
LPC55S0x
Supplier Device Package:
64-HTQFP (10x10)
Packaging:
Tray
Core Processor:
ARM® Cortex®-M33
Speed:
96MHz
Base Product Number:
LPC55S06
ECCN:
5A992C
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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC55S06JBD64E. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 256kb (256k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, pwm, rng, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 64-tqfp exposed pad. The product has typical 96k x 8 RAM size. The typical data converters include a/d 9x16b sar. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through can fd, flexcomm, i2c, spi, uart/usart. The product is a external, internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 45 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. The product lpc55s0x, is a highly preferred choice for users. 64-htqfp (10x10) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m33 is the product's core processor. It has a robust speed of 96mhz. Moreover, it corresponds to lpc55s06, a base product number of the product. The product is designated with the 5a992c code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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Wafer Fab 19/Mar/2023(PCN Assembly/Origin)
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Multi Design 02/25/2022(PCN Design/Specification)
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LPC55S0x/LPC550x 27/Apr/2023(PCN Design/Specification)
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LPC55S0x/LPC550x(Datasheets)
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LPC55- 05/Feb/2023(PCN Packaging)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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FAQs

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You will get a confirmation email regarding your order of NXP USA Inc. LPC55S06JBD64E. You can also check on our website or by contacting our customer support team for further order details on NXP USA Inc. LPC55S06JBD64E.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET20633610 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "NXP USA Inc." products on our website by using Enrgtech's Unique Manufacturing Part Number ET20633610.
Yes. We ship LPC55S06JBD64E Internationally to many countries around the world.