Silicon Labs EFM8BB31F16I-D-QFP32

EFM8BB31F16I-D-QFP32 Silicon Labs
Silicon Labs

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
16KB (16K x 8)
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature:
-40°C ~ 125°C (TA)
Voltage - Supply (Vcc/Vdd):
2.2V ~ 3.6V
Package / Case:
32-TQFP
RAM Size:
2.25K x 8
Program Memory Type:
FLASH
Connectivity:
I2C, SMBus, SPI, UART/USART
Package:
Tray
EEPROM Size:
-
Oscillator Type:
Internal
Number of I/O:
29
standardLeadTime:
20 Weeks
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
Busy Bee
Supplier Device Package:
32-QFP (7x7)
Data Converters:
A/D 20x12b; D/A 2x12b
Core Processor:
CIP-51 8051
Speed:
50MHz
Base Product Number:
EFM8BB31
ECCN:
3A991A2
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This is manufactured by Silicon Labs. The manufacturer part number is EFM8BB31F16I-D-QFP32. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 16kb (16k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, por, pwm, wdt. The product has -40°c ~ 125°c (ta) operating temperature range. The supply voltage of a bespoke product includes 2.2v ~ 3.6v. Moreover, the product comes in 32-tqfp. The product has typical 2.25k x 8 RAM size. It is a flash program memory type. It provides connectivity solutions through i2c, smbus, spi, uart/usart. It is shipped in tray package . The product is a internal type of oscillator. 29 is the I/O value of the product. It has a long 20 weeks standard lead time. It has a core size 8-bit. The product is available in surface mount configuration. The product busy bee, is a highly preferred choice for users. 32-qfp (7x7) is the supplier device package value. The typical data converters include a/d 20x12b; d/a 2x12b. cip-51 8051 is the product's core processor. It has a robust speed of 50mhz. Moreover, it corresponds to efm8bb31, a base product number of the product. The product is designated with the 3a991a2 code number.

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New Lead Frame 07/Dec/2022(PCN Assembly/Origin)
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Labeling Change 14/Dec/2021(PCN Packaging)
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IC/SIP MOQ Chg 11/Jan/2022(PCN Packaging)

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