NXP USA Inc. LPC55S26JBD100K

LPC55S26JBD100K NXP USA Inc.
LPC55S26JBD100K
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
256KB (256K x 8)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Package / Case:
100-LQFP Exposed Pad
RAM Size:
144K x 8
Data Converters:
A/D 10x16b
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
edacadModel:
LPC55S26JBD100K Models
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
edacadModelUrl:
/en/models/10649978
EEPROM Size:
-
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Qualification:
-
Number of I/O:
64
standardLeadTime:
13 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Single-Core
Mounting Type:
Surface Mount
Grade:
-
Series:
LPC55S2x
Supplier Device Package:
100-HLQFP (14x14)
Packaging:
Tray
Core Processor:
ARM® Cortex®-M33
Speed:
150MHz
Base Product Number:
LPC55S26
ECCN:
5A992C
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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC55S26JBD100K. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 256kb (256k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, pwm, rng, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 100-lqfp exposed pad. The product has typical 144k x 8 RAM size. The typical data converters include a/d 10x16b. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through flexcomm, i2c, mmc/sd/sdio, spi, uart/usart, usb. The product is a external, internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 64 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. The product lpc55s2x, is a highly preferred choice for users. 100-hlqfp (14x14) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m33 is the product's core processor. It has a robust speed of 150mhz. Moreover, it corresponds to lpc55s26, a base product number of the product. The product is designated with the 5a992c code number.

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LPC552x Fact Sheet(Product Brief)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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LPC55yy Wafer Fab 02/May/2024(PCN Assembly/Origin)
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LPC55S6x/LPC55S2x/LPC552x 22/Dec/2022(PCN Design/Specification)
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LPC55x 17/Apr/2022(PCN Design/Specification)
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LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022(PCN Packaging)
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Mult Dev Pkg Seal 15/Dec/2020(PCN Packaging)

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FAQs

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