Epson Electronics America Inc-Semiconductor Div S1C17W18F101100
Product Information
HTSUS:
8542.31.0001
Program Memory Size:
96KB (96K x 8)
Number of I/O:
67
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd):
1.2V ~ 3.6V
Package / Case:
80-TQFP
RAM Size:
8K x 8
Peripherals:
LCD, PWM, RFC, WDT
Program Memory Type:
FLASH
Connectivity:
I²C, IrDA, SPI, UART/USART
Package:
Tray
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
standardLeadTime:
38 Weeks
DigiKey Programmable:
Not Verified
Core Size:
16-Bit
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
80-TQFP14 (12x12)
Data Converters:
A/D 9x12b
Core Processor:
S1C17
Speed:
4.2MHz
Base Product Number:
S1C17W18
ECCN:
EAR99
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Yes. We ship S1C17W18F101100 Internationally to many countries around the world.
This is manufactured by Epson Electronics America Inc-Semiconductor Div. The manufacturer part number is S1C17W18F101100. It is assigned with possible HTSUS value of 8542.31.0001. In addition, 96kb (96k x 8) is the program memory size. 67 is the I/O value of the product. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.2v ~ 3.6v. Moreover, the product comes in 80-tqfp. The product has typical 8k x 8 RAM size. It has supplied with other peripherals, such as lcd, pwm, rfc, wdt. It is a flash program memory type. It provides connectivity solutions through i²c, irda, spi, uart/usart. It is shipped in tray package . The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). It has a long 38 weeks standard lead time. It has a core size 16-bit. The product is available in surface mount configuration. 80-tqfp14 (12x12) is the supplier device package value. The typical data converters include a/d 9x12b. s1c17 is the product's core processor. It has a robust speed of 4.2mhz. Moreover, it corresponds to s1c17w18, a base product number of the product. The product is designated with the ear99 code number.
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