NXP USA Inc. MC9RS08KA2CSCR

MC9RS08KA2CSCR NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
2KB (2K x 8)
Peripherals:
LVD, POR, WDT
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Package / Case:
8-SOIC (0.154", 3.90mm Width)
RAM Size:
63 x 8
Packaging:
Tape & Reel (TR)
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
-
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of I/O:
4
standardLeadTime:
13 Weeks
DigiKey Programmable:
Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
RS08
Supplier Device Package:
8-SOIC
Data Converters:
-
Core Processor:
RS08
Speed:
10MHz
Base Product Number:
MC9RS08
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is MC9RS08KA2CSCR. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 2kb (2k x 8) is the program memory size. It has supplied with other peripherals, such as lvd, por, wdt. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 5.5v. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The product has typical 63 x 8 RAM size. In addition, tape & reel (tr) is the available packaging type of the product. It is a flash program memory type. In addition, it is reach unaffected. The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 4 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 8-bit. The product is available in surface mount configuration. The product rs08, is a highly preferred choice for users. 8-soic is the supplier device package value. rs08 is the product's core processor. It has a robust speed of 10mhz. Moreover, it corresponds to mc9rs08, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev A/T Chg 24/Jun/2021(PCN Assembly/Origin)
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MC9RS08KA1/2 Datasheet(Datasheets)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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Automated Packing Implementation 05/Jul/2023(PCN Packaging)
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Mult Dev Pkg Seal 15/Dec/2020(PCN Packaging)

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FAQs

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