Silicon Labs EFM8BB10F8G-A-SOIC16

Silicon Labs

Product Information

Width:
3.9 mm
Program Memory Size:
8kB
Height:
1.5mm
Automotive Standard:
AEC-Q100
Number of Timers:
4
RAM Size:
512bit
Data Bus Width:
8bit
Instruction Set Architecture:
MCU
Program Memory Type:
FLASH
Minimum Supply Voltage:
2.2V
Package Type:
SOIC
Analogue Comparators:
2
Maximum Clock Frequency:
25MHz
Product Type:
Microcontroller
Maximum Operating Temperature:
85°C
Device Core:
CIP-51
Length:
9.9mm
Standards/Approvals:
No
Pin Count:
16
Mount Type:
Surface
Maximum Power Dissipation Pd:
800mW
Maximum Expanded Memory Size:
256bit
Number of Programmable I/Os:
13
Series:
EFM8BB1
Maximum Supply Voltage:
3.6V
ADCs:
12 x 12 Bit
Minimum Operating Temperature:
-40°C
HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
8KB (8K x 8)
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd):
2.2V ~ 3.6V
Package / Case:
16-SOIC (0.154", 3.90mm Width)
RAM Size:
512 x 8
Data Converters:
A/D 12x12b
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
edacadModel:
EFM8BB10F8G-A-SOIC16 Models
Connectivity:
I2C, SMBus, SPI, UART/USART
edacadModelUrl:
/en/models/5115723
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
2 (1 Year)
Number of I/O:
13
standardLeadTime:
12 Weeks
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
Busy Bee
Supplier Device Package:
16-SOIC
Packaging:
Tube
Core Processor:
CIP-51 8051
Speed:
25MHz
Base Product Number:
EFM8BB10
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is manufactured by Silicon Labs. The manufacturer part number is EFM8BB10F8G-A-SOIC16. Furthermore, the product is 3.9 mm wide. In addition, 8kb is the program memory size. In addition, the height is 1.5mm. The product complies with automotive standard - aec-q100. It comprises 4 timers. The product has typical 512bit RAM size. Moreover, the data bus width includes 8bit. The instruction set has mcu architecture. It is a flash program memory type. It has a minimum 2.2v supply voltage . The package is a sort of soic. In addition, it has a maximum clock frequency about 25mhz . microcontroller is a versatile product designed to provide user-defined applications. It has a maximum operating temperature of 85°c. On the other hand, the cip-51 is the device core. Its accurate length is 9.9mm. It contains 16 pins. It has a surface type mount . The product efm8bb1, is a highly preferred choice for users. The product requires a maximum 3.6v supply voltage . The ADCs included 12 x 12 bit. Whereas, the minimum operating temperature of the product is -40°c. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 8kb (8k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, por, pwm, wdt. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 2.2v ~ 3.6v. Moreover, the product comes in 16-soic (0.154", 3.90mm width). The product has typical 512 x 8 RAM size. The typical data converters include a/d 12x12b. In addition, it is reach unaffected. It provides connectivity solutions through i2c, smbus, spi, uart/usart. The product is a internal type of oscillator. Its typical moisture sensitivity level is 2 (1 year). 13 is the I/O value of the product. It has a long 12 weeks standard lead time. It has a core size 8-bit. The product is available in surface mount configuration. The product busy bee, is a highly preferred choice for users. 16-soic is the supplier device package value. In addition, tube is the available packaging type of the product. cip-51 8051 is the product's core processor. It has a robust speed of 25mhz. Moreover, it corresponds to efm8bb10, a base product number of the product. The product is designated with the ear99 code number.

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EFM8BB1 Busy Bee 1 MCU Datasheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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EFM8BB1 Reference Manual(Manuals)
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EFM8 Series Datasheet 20/Mar/2024(PCN Design/Specification)
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EFM8 BB1/BB2 24/May/2017(PCN Design/Specification)
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EFM8BB1 Datasheet(Datasheets)
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Mult DEV Box/Shipping Label 20/Mar/2024(PCN Packaging)
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IC/SIP MOQ Chg 11/Jan/2022(PCN Packaging)

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