Bosch Sensortec Shuttle Board 3.0 BHI260AP, Shuttle Board for BHI260AP Application Board 3.0

The Shuttle Board 3.0 provides ready access to the programmable 6-axis IMU (BHI260AP), along with a suite of auxiliary sensors (including the BME688 environmental sensor, BMP390L pressure sensor, and BMM150 magnetometer), and on-board flash and EEPROM memory.

Salient Features and Benefits of Buying the Bosch Shuttle Board for APPLICATION BOARD 3.0

• Pre-mounted BHI260AP smart sensor with 32-bit microcontroller and 6-axis IMU for advanced sensor fusion.
• Includes environmental (BME688), pressure (BMP390L) and magnetometer (BMM150) sensors for broad-based measurement capability.
• Compatible with I²C/SPI/QSPI interfaces and supports direct plug-in to the Application Board 3.0 ecosystem.
• On-board EEPROM and 4 Mbit QSPI flash memory for firmware storage and custom algorithm deployment.
• Compact, socket-based design offers fast prototyping and pin-level sensor access for integration testing and development.

Engineered for Sensor Development and Prototyping

This shuttle board is tailored for engineers and developers working on embedded systems that require motion, orientation, environmental, and pressure data. The BHI260AP Shuttle Board 3.0 enables rapid exploration of sensor fusion algorithms, system-level evaluation and embedded firmware development. This makes it highly effective for early-stage development in IoT devices, wearables, robotics and smart industrial applications.

Where to Use this Shuttle Board?

• Rapid prototyping of wearable motion sensors.
• Embedded system evaluation for robotics or drones.
• Environmental and pressure sensing in portable instrumentation.
• Firmware development for sensor hubs.
• System-level testing in smart home, industrial monitoring or mobile electronics designs.

For more information please check the datasheets.