Dual N/P-Channel-Channel MOSFET, 4.4 A, 6.2 A, 40 V, 8-Pin SOIC onsemi FDS4897C

FDS4897C Dual N/P-Channel-Channel MOSFET, 4.4 A, 6.2 A, 40 V, 8-Pin SOIC onsemi
FDS4897C
onsemi

Product Information

Maximum Continuous Drain Current:
4.4 A, 6.2 A
Transistor Material:
Si
Width:
4mm
Transistor Configuration:
Isolated
Maximum Drain Source Voltage:
40 V
Package Type:
SOIC
Number of Elements per Chip:
2
Minimum Gate Threshold Voltage:
1V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
14 nC @ 10 V, 20 nC @ 10 V
Channel Type:
N, P
Length:
5mm
Pin Count:
8
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
2 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
1.5mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
29 mΩ, 46 mΩ
FET Feature:
Logic Level Gate
HTSUS:
8541.21.0095
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Rds On (Max) @ Id, Vgs:
29mOhm @ 6.2A, 10V
Gate Charge (Qg) (Max) @ Vgs:
20nC @ 10V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
Current - Continuous Drain (Id) @ 25°C:
6.2A, 4.4A
Configuration:
N and P-Channel
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
40V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Input Capacitance (Ciss) (Max) @ Vds:
760pF @ 20V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
8-SOIC
Power - Max:
900mW
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FDS4897
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is Dual N/P-Channel-Channel MOSFET 4.4 A 6.2 A 40 V 8-Pin SOIC manufactured by onsemi. The manufacturer part number is FDS4897C. While 4.4 a, 6.2 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 4mm wide. The product offers isolated transistor configuration. It has a maximum of 40 v drain source voltage. The package is a sort of soic. It consists of 2 elements per chip. Whereas its minimum gate threshold voltage includes 1v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 14 nc @ 10 v, 20 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 5mm. It contains 8 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 2 w maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -20 v, +20 v. In addition, the height is 1.5mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 29 mω, 46 mω maximum drain source resistance. The FET features of the product include logic level gate. It is assigned with possible HTSUS value of 8541.21.0095. The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). It has a maximum Rds On and voltage of 29mohm @ 6.2a, 10v. The maximum gate charge and given voltages include 20nc @ 10v. The product is rohs3 compliant. In addition, it is reach unaffected. The continuous current drain at 25°C is 6.2a, 4.4a. The product is available in n and p-channel configuration. It is shipped in tape & reel (tr) package . The product has a 40v drain to source voltage. Its typical moisture sensitivity level is 1 (unlimited). The product's input capacitance at maximum includes 760pf @ 20v. The product powertrench®, is a highly preferred choice for users. 8-soic is the supplier device package value. The maximum power of the product is 900mw. This product use mosfet (metal oxide) technology. Moreover, it corresponds to fds4897, a base product number of the product. The product is designated with the ear99 code number.

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Trans MOSFET N/P-CH 40V 6.2A/4.4A 8-SOIC(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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onsemi RoHS(Environmental Information)
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onsemi REACH(Environmental Information)
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Wafer Fab 02/Aug/2020(PCN Assembly/Origin)
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Mold Compound 12/Dec/2007(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult DEV EOL 22/Dec/2023(PCN Obsolescence/ EOL)
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FDS4897C(Datasheets)
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Mult MSL1 Pkg Rev 20/Dec/2018(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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