N-Channel MOSFET, 300 mA, 600 V, 3-Pin TO-92 onsemi FQN1N60CTA

FQN1N60CTA N-Channel MOSFET, 300 mA, 600 V, 3-Pin TO-92 onsemi
FQN1N60CTA
onsemi

Product Information

Maximum Continuous Drain Current:
300 mA
Transistor Material:
Si
Width:
4.19mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
600 V
Package Type:
TO-92
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
2V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
4.8 nC @ 10 V
Channel Type:
N
Length:
5.2mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Through Hole
Maximum Power Dissipation:
1 W
Series:
QFET
Maximum Gate Source Voltage:
-30 V, +30 V
Height:
5.33mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
11.5 Ω
FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
4V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Rds On (Max) @ Id, Vgs:
11.5Ohm @ 150mA, 10V
edacadModel:
FQN1N60CTA Models
Gate Charge (Qg) (Max) @ Vgs:
6.2 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
edacadModelUrl:
/en/models/1923038
Package:
Cut Tape (CT)
Drain to Source Voltage (Vdss):
600 V
Vgs (Max):
±30V
Moisture Sensitivity Level (MSL):
Not Applicable
Power Dissipation (Max):
1W (Ta), 3W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
170 pF @ 25 V
Mounting Type:
Through Hole
Series:
QFET®
Supplier Device Package:
TO-92-3
Current - Continuous Drain (Id) @ 25°C:
300mA (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FQN1N60
ECCN:
EAR99
RoHs Compliant
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This is N-Channel MOSFET 300 mA 600 V 3-Pin TO-92 manufactured by onsemi. The manufacturer part number is FQN1N60CTA. While 300 ma of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 4.19mm wide. The product offers single transistor configuration. It has a maximum of 600 v drain source voltage. The package is a sort of to-92. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 2v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 4.8 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 5.2mm. It contains 3 pins. The product carries enhancement channel mode. The product is available in through hole configuration. Provides up to 1 w maximum power dissipation. The product qfet, is a highly preferred choice for users. It features a maximum gate source voltage of -30 v, +30 v. In addition, the height is 5.33mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 11.5 ω maximum drain source resistance. It is assigned with possible HTSUS value of 8541.29.0095. The typical Vgs (th) (max) of the product is 4v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-226-3, to-92-3 (to-226aa) formed leads. It has a maximum Rds On and voltage of 11.5ohm @ 150ma, 10v. The maximum gate charge and given voltages include 6.2 nc @ 10 v. The product is rohs3 compliant. In addition, it is reach unaffected. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 10v. It is shipped in cut tape (ct) package . The product has a 600 v drain to source voltage. The maximum Vgs rate is ±30v. Its typical moisture sensitivity level is not applicable. The product carries maximum power dissipation 1w (ta), 3w (tc). The product's input capacitance at maximum includes 170 pf @ 25 v. The product qfet®, is a highly preferred choice for users. to-92-3 is the supplier device package value. The continuous current drain at 25°C is 300ma (tc). This product use mosfet (metal oxide) technology. Moreover, it corresponds to fqn1n60, a base product number of the product. The product is designated with the ear99 code number.

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Datasheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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onsemi RoHS(Environmental Information)
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onsemi REACH(Environmental Information)
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Wafer Fab 28/Jul/2021(PCN Assembly/Origin)
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Logo 17/Aug/2017(PCN Design/Specification)
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Drawing Update 18/Apr/2021(PCN Design/Specification)
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Mult Dev EOL 30/Jun/2022(PCN Obsolescence/ EOL)
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FQN1N60C(Datasheets)
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Mult Devices 24/Oct/2017(PCN Packaging)

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