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United Kingdom
This high-quality MBO SN63/PB no-clean wire solder is engineered for precision electronic assembly, providing a reliable, clean soldering solution. The composition is a eutectic alloy of 63% Tin and 37% Lead (Sn63/Pb37), providing a low and consistent melting point of 183°C for efficient operation. With an ultra-fine 0.35mm diameter, it is perfectly suited for intricate work and surface-mount device (SMD) repairs. The integrated 1.5% rosin flux is formulated to be non-corrosive and leaves minimal, non-conductive residue, eliminating the need for post-soldering cleaning.
The no-clean flux system of the solder wire is a significant advantage, drastically reducing manufacturing time and eliminating the cost of post-soldering cleaning processes. Its low melting point minimises thermal stress on sensitive electronic components, ensuring joint integrity and component longevity. The precise wire diameter guarantees accurate material deposition for high-density circuits.
For more information please check the datasheets.
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£ 0.000