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Multicore

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291001, Multicore

291001, Multicore

No Clean De-soldering Wick This no-clean wick (supplied in an antistatic box) dispenses with the need for any sort of cleaning after de-soldering. The copper braiding is covered in a synthetic resin (without halogen) which facilitates more rapid absorption of the solder, leaving behind a negligible quantity of non-corrosive & non-hygroscopic residue Wick & Braid
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450314, Multicore

450314, Multicore

63/37 400 2% .022DIA 23AWG
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290998, Multicore

290998, Multicore

NC AB WICK
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1372425, Multicore

1372425, Multicore

97SCL F620 DAP89V
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733010, Multicore

733010, Multicore

96SC C511 3C 0.81MM 0.5KG .032"
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568759, Multicore

568759, Multicore

SAV1 366 5C 1.22MM 0.5KG AM
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291337, Multicore

291337, Multicore

RA Type Surface Mount Paste Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot plates and even conventional electric irons. Standard particle size available Residue may be left without cleaning Long open time (72 hours) % Tin (Sn) 62 % Lead (Pb) 40 Approx. Melting Point °C 179 Particle Size (μm) 75 max. Note Store in a cool place e.g. Refrigerator. Solder Paste - Leaded
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386824, Multicore

386824, Multicore

60/40 370 3% .024DIA 22AWG
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583729, Multicore

583729, Multicore

Solder wire Sn95.5 Ag3.5 Cu0.7 96SC Crystal 400 No-Clean solder wire with incorporated flux. On a spool. Halide-free. Constant heat, low spatter. High speed soldering, range of activities suitable for all applications. Good spread on copper, brass and nickel. Clear residue. Stock no. Section Weight 226-136 0.25 mm² 250 g 226-243 0.50 mm² 250 g 226-237 0.70 mm² 500 g 226-215 1 mm² 500 g Standards J-STD-004, EN29453.
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291347, Multicore

291347, Multicore

'Extrusol'® Stick Solder Extruded solder containing 60% tin and 40% lead which is ideal for solder baths or pots. The high purity and lack of undesirable elements gives less dross on initial melting, more solder joints weight for weight, improved wetting of electronic components and PCB's and more uniform results. Approximate melting point 183-215°C Stick weight 80 g % Tin (Sn) 60 % Lead (Pb) 40 Approx. Melting Point °C 183-215 Leaded Stick Solder
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981501, Multicore

981501, Multicore

SAC305 BAR SOLDR 2.5LB +/- 0.2LB
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1179441, Multicore

1179441, Multicore

63/37 381 5C 0.81MM 0.5KG AM
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Related Categories: Toggle Switches & Accessories Panel Indicators, Pilot Lights Temperature Calibrators Potentiometer Kits Switches Network & Telecom Connectors Safety Tags Handheld Computer Accessories Solder Solder Pastes
Related Products: Multicore 386824 Multicore 1042097 Multicore 796065 Multicore 1.22mm Wire Lead solder, +183 → +215°C Melting Point, 48.5% Lead, 1.5% Copper, 50% Tin, 500g Multicore 1.2mm Wire Lead solder, 183 → 188°C Melting Point, 40% Lead, 60% Tin, 500g Multicore 0.7mm Wire Lead solder, +183°C Melting Point Multicore 25g Syringe Solder Paste Multicore 733002 Multicore 0.7mm Wire Lead solder, 183 → 188°C Melting Point, 40% Lead, 60% Tin, 500g Multicore 397102 Multicore 0.71mm Wire Lead solder, +183 → +215°C Melting Point, 48.5% Lead, 1.5% Copper, 50% Tin, 500g Multicore 673832 Multicore 395439 Multicore 0.5 → 0.56mm Wire Lead solder, +179°C Melting Point, 36% Lead, 62% Tin, 2% Silver, 250g Multicore 0.71mm Wire Lead solder, +183 → +188°C Melting Point, 40% Lead, 60% Tin, 500g Multicore 1.2mm Wire Lead solder, +179°C Melting Point Multicore 0.7mm Wire Lead solder, 183 → 188°C Melting Point, 40% Lead, 60% Tin, 250g Multicore 1mm Wire Lead Free Solder, +217°C Melting Point Multicore 732977 Multicore 389261