USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
RoHS Status:
ROHS3 Compliant
Number of Cores/Bus Width:
4 Core, 32-Bit
Supplier Device Package:
569-MAPBGA (12x12)
Additional Interfaces:
CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Operating Temperature:
-20°C ~ 105°C (TJ)
Package / Case:
569-LFBGA
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2
Manufacturer:
NXP Semiconductors
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Ethernet:
10/100/1000Mbps (1)
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Mounting Type:
Surface Mount
Series:
i.MX6Q
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Packaging:
Bulk
SATA:
SATA 3Gbps (1)
Core Processor:
ARM® Cortex®-A9
Speed:
800MHz
