USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Number of Cores/Bus Width:
1 Core, 32-Bit
Supplier Device Package:
529-FBGA (19x19)
Additional Interfaces:
1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
529-FBGA
Co-Processors/DSP:
Multimedia; NEON™ SIMD
REACH Status:
REACH Unaffected
RAM Controllers:
LPDDR2, DDR2, DDR3
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Ethernet:
10/100Mbps (1)
standardLeadTime:
15 Weeks
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Mounting Type:
Surface Mount
Series:
i.MX53
Voltage - I/O:
1.3V, 1.8V, 2.775V, 3.3V
SATA:
SATA 1.5Gbps (1)
Core Processor:
ARM® Cortex®-A8
Speed:
800MHz
Base Product Number:
MCIMX537
ECCN:
5A992C
The NXP USA Inc. MCIMX537CVP8C2R2 is a rugged microprocessor created for high-performance embedded applications. It features the ARM Cortex-A8 core architecture and operates at a clock speed of 800MHz. This 32-bit microprocessor comes in a 529-FBGA (19x19) package, making it appropriate for compact and space-constrained designs.
Potential Applications of NXP USA Inc. MCIMX537CVP8C2R2:
The NXP MCIMX537CVP8C2R2 microprocessor can be utilised in various applications, such as industrial automation, automotive infotainment systems, mobile multimedia devices, and embedded computing platforms. Its high performance, power efficiency, and compact form factor make it a perfect option for developers working on demanding projects.
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