Texas Instruments TPS2330IPW

TPS2330IPW Texas Instruments
Texas Instruments

Product Information

Programmable Features:
Circuit Breaker, Fault Timeout, Slew Rate
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C
Current - Output (Max):
-
Package / Case:
14-TSSOP (0.173", 4.40mm Width)
Type:
Hot Swap Controller
Internal Switch(s):
No
REACH Status:
REACH Unaffected
edacadModel:
TPS2330IPW Models
Applications:
General Purpose
Current - Supply:
500 µA
Number of Channels:
1
edacadModelUrl:
/en/models/306198
Manufacturer:
Texas Instruments
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
6 Weeks
Features:
Latched Fault, UVLO
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
14-TSSOP
Packaging:
Tube
Voltage - Supply:
3V ~ 13V
Base Product Number:
TPS2330
ECCN:
EAR99
Checking for live stock

This is manufactured by Texas Instruments. The manufacturer part number is TPS2330IPW. Programmable Specifications - circuit breaker, fault timeout, slew rate. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 14-tssop (0.173", 4.40mm width). It comes in hot swap controller configuration. Internal switch options: no. In addition, it is reach unaffected. The product is widely employed in general purpose. The current - supply of a bespoke product is 500 µa. It is supplied with 1 channels. The texas instruments's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). It has a long 6 weeks standard lead time. The splendid features of the product include latched fault, uvlo. The product is available in surface mount configuration. 14-tssop is the supplier device package value. In addition, tube is the available packaging type of the product. It has optimum voltage supply of 3v ~ 13v. Moreover, it corresponds to tps2330, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Assembly/Wafer Site 08/Feb/2024(PCN Assembly/Origin)
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Design 22/Feb/2022(PCN Design/Specification)
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Device Symbolization Change 13/Jun/2023(PCN Packaging)

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