Vishay Semiconductor Diodes Division V30D45C-M3/I

V30D45C-M3-I Vishay Semiconductor Diodes Division V30D45C-M3/I
Vishay Semiconductor Diodes Division

Product Information

Manufacturer Standard Lead Time:
8 Weeks
Base Part Number:
V30D45
Detailed Description:
Diode Array 1 Pair Common Cathode Schottky 45V 15A Surface Mount TO-263-3, D²Pak (2 Leads + Tab) Variant
Current - Reverse Leakage @ Vr:
1.5mA @ 45V
Operating Temperature - Junction:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Series:
eSMP®, TMBS®
Voltage - Forward (Vf) (Max) @ If:
570mV @ 15A
Supplier Device Package:
SMPD
Packaging:
Cut Tape (CT)
Current - Average Rectified (Io) (per Diode):
15A
Diode Configuration:
1 Pair Common Cathode
Customer Reference:
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab) Variant
Voltage - DC Reverse (Vr) (Max):
45V
Diode Type:
Schottky
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Manufacturer:
Vishay Semiconductor Diodes Division
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This is manufactured by Vishay Semiconductor Diodes Division. The manufacturer part number is V30D45C-M3/I. It has typical 8 weeks of manufacturer standard lead time. Base Part Number: v30d45. It features diode array 1 pair common cathode schottky 45v 15a surface mount to-263-3, d²pak (2 leads + tab) variant. 1.5ma @ 45v is the reverse leakage value of a bespoke product. The product operate at temperatures ranging from -40°c ~ 150°c. The product is available in surface mount configuration. The product esmp®, tmbs®, is a highly preferred choice for users. The product has a maximum forward voltage of 570mv @ 15a. smpd is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The average rectified current at per diode is 15a. The diode features a 1 pair common cathode configuration. Moreover, the product comes in to-263-3, d²pak (2 leads + tab) variant. While it has maximum reverse voltage of 45v. It is designed with a schottky diode. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The vishay semiconductor diodes division's product offers user-desired applications.

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Wafer Material Update 30/Jun/2015(PCN Assembly/Origin)
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V30D45C(Datasheets)

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