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The IPC0242-S is a high-grade tool designed for accurate solder paste application in electronics assembly and rework. This stencil module is essential for high-quality solder joints in professional electronics manufacturing.
The Chip Quik Inc. IPC0242-S is a specialised tool for precise solder paste application in electronics assembly and rework processes. With a focus on accuracy and compatibility with fine-pitch components, this stainless-steel stencil is a valuable asset for professionals engaged in modern electronics manufacturing.
The IPC0242-S Module-29 is engineered to enable precise solder paste application onto printed circuit boards (PCBs) during the soldering process. The stencil's fine design details and high-quality construction contribute to accurate solder paste deposition, enhancing the quality of solder joints.
This stainless-steel stencil is tailored to handle components with a pitch as small as 1.016 mm. As electronic components become increasingly compact and densely packed, accurately applying solder paste to such fine-pitch components becomes vital for ensuring reliable connections and optimal functionality.
With a body size of 21.72 x 14.73 mm, the IPC0242-S Module-29 Stainless Steel Stencil is designed for compatibility with a range of electronic components and PCB layouts. This optimised size ensures that the stencil can be easily manoeuvred and aligned during the solder paste application process.
The stainless-steel stencil is particularly well-suited for professional electronics manufacturing environments. It supports consistently producing high-quality solder joints in various applications, including surface-mount technology (SMT) assembly, rework, and prototyping.
Constructed from stainless steel, the IPC0242-S Module-29 Stencil offers durability and longevity. The stencil's robust design ensures its ability to withstand repeated use without compromising its accuracy and performance.
For more information please check the datasheets.
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