Microchip Technology MCP23017-E/ML

MCP23017-E-ML Microchip Technology MCP23017-E/ML
Microchip Technology

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Interrupt Output:
Yes
Operating Temperature:
-40°C ~ 125°C
Package / Case:
28-VQFN Exposed Pad
REACH Status:
REACH Unaffected
Output Type:
Push-Pull
edacadModel:
MCP23017-E/ML Models
Interface:
I2C
Package:
Tube
Moisture Sensitivity Level (MSL):
3 (168 Hours)
edacadModelUrl:
/en/models/894270
Clock Frequency:
1.7 MHz
Number of I/O:
16
standardLeadTime:
7 Weeks
Current - Output Source/Sink:
25mA
Features:
POR
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
28-QFN (6x6)
Voltage - Supply:
1.8V ~ 5.5V
Base Product Number:
MCP23017
ECCN:
EAR99
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is MCP23017-E/ML. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. Interrupt output Options - yes. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 28-vqfn exposed pad. In addition, it is reach unaffected. Furthermore, it has apush-pull output. A bespoke product is i2c interface. It is shipped in tube package . Its typical moisture sensitivity level is 3 (168 hours). The product boasts a clock frequency of 1.7 mhz. 16 is the I/O value of the product. It has a long 7 weeks standard lead time. The current of output source/sink is 25ma. The splendid features of the product include por. The product is available in surface mount configuration. 28-qfn (6x6) is the supplier device package value. It has optimum voltage supply of 1.8v ~ 5.5v. Moreover, it corresponds to mcp23017, a base product number of the product. The product is designated with the ear99 code number.

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MCP23017, MCP23S17 Datasheet(UNKNOWN TYPE)
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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Assembly Site 22/Nov/2023(PCN Assembly/Origin)
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Development Tools Catalog(Manuals)
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Bond Wire Material Update 21/Oct/2016(PCN Design/Specification)
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MCP23017/MCP23S17 01/Jul/2022(PCN Design/Specification)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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