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The Fischer Elektronik THFU 2 is a stainless‑steel retaining spring engineered for secure mounting of TO‑style semiconductor packages (TO‑218, TO‑220, TO‑247, TO‑248, TO‑3P) to LAM and SK series heatsinks. It enables reliable thermal contact and mechanical fixation under vibration and thermal cycling conditions. The compact clip‑style design ensures fast installation and consistent pressure across the interface, reducing thermal resistance and improving device reliability in power conversion, industrial electronics, and thermal management applications.
The THFU 2 retaining spring is designed to deliver dependable performance in demanding electronics environments. Maintaining consistent clamping force keeps the semiconductor package flush against the heatsink base, reducing the risk of hotspots and delamination over the operating life. Its stainless‑steel material withstands repeated thermal cycles and mechanical stress, making it well‑suited for industrial power modules, converters, and electronics assemblies where reliability is critical.
For more information please check the datasheets.
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