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W30522TRC, Winslow

W30522TRC, Winslow

Turned Pin, DIP Sockets Low profile high-quality machined contact DIP sockets comprising a four-finger (0.3μm)gold over nickel-plated beryllium-copper inner contact with a tin-plated brass outer shell. Temperature Range: -55°C to +125°C Insertions: 1000
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W9053RC, Winslow

W9053RC, Winslow

Winslow Adaptics Adaptors Programming adaptors for prototyping and development using AVR microcontrollers Converts the IC package format into a standard d.i.l. plug in configuration Facilitates programming and testing Can be used with most programmers to allow programmimg of other package types Selection Guide stock no. IC package dil plug Winslow part no. Atmel part no. 388-4384 SSOP 20 20 W9945 AT90S1200-12PC 388-4407 SOIC 20 20 W10618 AT90S1200-12SC 388-4413 TQFP 44(0.8) 20 W9901 AT90S8515 388-4429 PLCC 44 40 W9333 AT90S8515-8JC 388-4435 PLCC 44 40 W9051 AT90S8535 388-4441 TQFP 44(0.8) 40 W9053 AT90S08535 Programming Adaptors
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W9502RC, Winslow

W9502RC, Winslow

SOIC to DIP Sockets Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4 Dimensions DIP Pitch (in.) SOIC Pitch (in.) PCB Dim. (in.) PCB Dim. (in.) Winslow Part No. Number of Pins L W 0.3 0.237 0.4 0.5 W9501 8 0.3 0.237 0.7 0.5 W9502 14 0.3 0.237 0.8 0.5 W9503 16 0.3 0.237 0.9 0.5 W9504 18 0.3 0.237 1.0 0.5 W9505 20 0.6 0.540 1.2 0.8 W9506 24 0.6 0.460 1.3 0.8 W9513 24 0.3 0.375 1.2 0.6 W9507 24 0.6 0.375 1.4 0.8 W9508 28 0.6 0.375 1.6 0.8 W9509 32 0.6 0.540 1.7 0.8 W9512 32 IC Sockets-Package Adaptics DIP A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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WA13067DQAETRC, Winslow

WA13067DQAETRC, Winslow

QFN to PGA Pin Adapters 'Adaptics' converting Quad-Flat No-Leads packages (QFN) to Pin Grid Array (PGA) format. Note Adapter contains no central GND pad. IC Sockets-Package Adaptics A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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WPLCC032-1PTRC, Winslow

WPLCC032-1PTRC, Winslow

Through Hole Mount Plastic leaded chip carrier (PLCC) sockets with through hole solder tails 2.54mm grid matching JEDEC patterns Stand - offs aid cleaning and heat dissipation Suitable extraction tool (stock no. 480-3005 ) Insulation material: Glass filled polyester Insulation resistance 1000MΩ Temperature range -50 to +105°C Dimensions (mm) Stock No W. L. H* 378-9756 15.50 15.50 7.66 378-9778 18.75 21.63 7.66 378-9784 23.50 23.50 7.66 378-9790 25.90 25.90 7.66 378-9807 32.00 32.00 7.66 378-9813 37.00 37.00 7.66 Note *Height above PCB IC Sockets-PLCC Adaptics Sockets (mΩ)
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W9583RC, Winslow

W9583RC, Winslow

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors 'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format. IC Sockets-Package Adaptics DIP A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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W3164/607TRC, Winslow

W3164/607TRC, Winslow

Shrink DIP Sockets Stamped and turned pin, low insertion force Shrink DIP sockets with a pin spacing of 0.07in The stamped pins being tin-plated phosphor bronze, the turned pins having a gold over nickel-plated inner contact with a tin-plated brass outer shell
New items
WS3172SMLRC, Winslow

WS3172SMLRC, Winslow

Micro-Edge SIMM Sockets 30 and 72 way vertical and angled SIMM® sockets incorporating either plastic or metal latches. All versions feature low profile, high pressure tin-plated contacts that accept standard module board thickness. The sockets require a very low insertion force and have right polarisation, unless otherwise stated with polarising posts which coincide with cut-outs on the board, to prevent mis-insertion. Pitch between pins 30-way is 0.1in. (typ.), 72-way is 0.05in. (typ.) Body Material Liquid Crystal Polymer Contact Material Phosphor Bronze Contact Plating Tin; Lead Insulation Resistance 10000MΩ Flammability UL 94 V-0 Typical Life 25 Cycles Operating Temperature -55°C to +150°C
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W9530RC, Winslow

W9530RC, Winslow

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors 'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format. IC Sockets-Package Adaptics DIP A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
New items
W9535PRC, Winslow

W9535PRC, Winslow

DIP to SOIC Sockets Two piece ’Adaptics’ that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier. PCB: Epoxy Fibreglass FR4 Dimensions No. Pins DIP Pitch (in.) SOIC Pitch (in.) Winslow Part No. Stock No 14 0.3 0.237 W9534P 240-6595 16 0.3 0.237 W9535P 240-6602 18 0.3 0.237 W9539P 240-6618 20 0.3 0.237 W9540P 240-6624 28 0.6 0.375 W9547P 240-6646 IC Sockets-Package Adaptics DIP A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
New items
W13046RC, Winslow

W13046RC, Winslow

QFN to DIP Pin Adapters 'Adaptics' converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to Dual In Line Package (DIP) format. IC Sockets-Package Adaptics A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
New items
WPLCC084-ST1RC, Winslow

WPLCC084-ST1RC, Winslow

SMT PLCC Sockets A range of PLCC surface mount sockets with phosphor bronze contacts. The contacts are set on a 0.1in. grid to match JEDEC patterns. Polarising feature ensures correct insertion of chip carriers. Suitable extraction tool (stock no. 480-3005) Low profile design, only 4.5mm high Window for solder joint inspection Standoffs for easy PCB cleaning Voltage rating: 100Vac rms/150Vdc Insulation resistance 1000MΩ Typical Life 100 cycles Dimensions (mm) Stock No Inside Length Outside Length 180-7644 5.08 15.58 180-7650 7.62 18.12 180-7666 7.62x10.16* 18.12x20.56* 180-7672 12.70 23.20 180-7694 15.24 25.74 180-7701 20.32 30.82 180-7717 25.40 35.9 Note * Rectangular Socket IC Sockets-PLCC Adaptics Sockets (mΩ)