AMD XC3S250E-4FTG256C

XC3S250E-4FTG256C AMD
AMD

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Package / Case:
256-LBGA
Number of I/O:
172
Operating Temperature:
0°C ~ 85°C (TJ)
DigiKey Programmable:
Not Verified
REACH Status:
REACH Unaffected
Total RAM Bits:
221184
Number of Logic Elements/Cells:
5508
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of LABs/CLBs:
612
Mounting Type:
Surface Mount
Number of Gates:
250000
Series:
Spartan®-3E
Supplier Device Package:
256-FTBGA (17x17)
Packaging:
Tray
Voltage - Supply:
1.14V ~ 1.26V
Base Product Number:
XC3S250
ECCN:
EAR99
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This is manufactured by AMD. The manufacturer part number is XC3S250E-4FTG256C. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. Moreover, the product comes in 256-lbga. 172 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. In addition, it is reach unaffected. It include a total of 221184 RAM bits. The product contains 5508 logic cells/elements. Its typical moisture sensitivity level is 3 (168 hours). It consists of 612 CLBs/LABs. The product is available in surface mount configuration. It contains 250000 gates. The product spartan®-3e, is a highly preferred choice for users. 256-ftbga (17x17) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 1.14v ~ 1.26v. Moreover, it corresponds to xc3s250, a base product number of the product. The product is designated with the ear99 code number.

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Xilinx REACH211 Cert(Environmental Information)
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All product New AMD Logo 13/May/2024(PCN Design/Specification)
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Mult DEV EOL 01/Jan/2024(PCN Obsolescence/ EOL)

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