ON Semiconductor MBRA210LT3G

MBRA210LT3G ON Semiconductor
MBRA210LT3G
ON Semiconductor

Product Information

Mounting Type:
Surface Mount
Maximum Continuous Forward Current:
2A
Peak Non-Repetitive Forward Surge Current:
160A
Maximum Forward Voltage Drop:
260mV
Diode Technology:
Schottky
Package Type:
DO-214AC (SMA)
Number of Elements per Chip:
1
Diode Type:
Schottky
Diode Configuration:
Single
Pin Count:
2
Peak Reverse Repetitive Voltage:
10V
Manufacturer Standard Lead Time:
52 Weeks
Base Part Number:
MBRA210
Detailed Description:
Diode Schottky 10V 2A Surface Mount SMA
Current - Reverse Leakage @ Vr:
700µA @ 10V
Operating Temperature - Junction:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Voltage - DC Reverse (Vr) (Max):
10V
Voltage - Forward (Vf) (Max) @ If:
350mV @ 2A
Supplier Device Package:
SMA
Packaging:
Cut Tape (CT)
Customer Reference:
Current - Average Rectified (Io):
2A
Package / Case:
DO-214AC, SMA
Diode Type:
Schottky
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Manufacturer:
ON Semiconductor
RoHs Compliant
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This is manufactured by ON Semiconductor. The manufacturer part number is MBRA210LT3G. The product is available in surface mount configuration. Furthermore, its maximum continuous forward current constitutes 2a. Moreover, a bespoke product has 160a peak non-repetitive forward surge current. It features 260mv of maximum forward voltage drop. The product utilizes schottky diode technology. The package is a sort of do-214ac (sma). It consists of 1 elements per chip. It is designed with a schottky diode. The diode features a single configuration. It contains 2 pins. While having the peak reverse repetitive 10v. It has typical 52 weeks of manufacturer standard lead time. Base Part Number: mbra210. It features diode schottky 10v 2a surface mount sma. 700µa @ 10v is the reverse leakage value of a bespoke product. The product operate at temperatures ranging from -55°c ~ 125°c. While it has maximum reverse voltage of 10v. The product has a maximum forward voltage of 350mv @ 2a. sma is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. It features a 2a of average rectified current. Moreover, the product comes in do-214ac, sma. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The on semiconductor's product offers user-desired applications.

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Datasheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Qualification Assebly/Test Site 18/Mar/2014(PCN Assembly/Origin)
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Metal Chg/Die Shrink Upd 22/Sep/2016(PCN Design/Specification)
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MBRA210LT3(Datasheets)

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