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Texas Instruments LMV762MAX/NOPB

LMV762MAX-NOPB Texas Instruments LMV762MAX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Current - Input Bias (Max):
50pA @ 5V
Current - Quiescent (Max):
700µA
Operating Temperature:
-40°C ~ 125°C
Voltage - Supply, Single/Dual (±):
2.7V ~ 5V
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Type:
General Purpose
Propagation Delay (Max):
225ns
REACH Status:
REACH Unaffected
Output Type:
Push-Pull
Hysteresis:
-
edacadModel:
LMV762MAX/NOPB Models
edacadModelUrl:
/en/models/1872383
CMRR, PSRR (Typ):
100dB CMRR, 110dB PSRR
Package:
Tape & Reel (TR)
Voltage - Input Offset (Max):
0.2mV @ 5V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Output (Typ):
-
standardLeadTime:
6 Weeks
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Number of Elements:
2
Base Product Number:
LMV762
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMV762MAX/NOPB. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The maximum input bias current includes 50pa @ 5v. It has a maximum quiescent current of 700µa. The product has -40°c ~ 125°c operating temperature range. It features a typical 2.7v ~ 5v voltage of single or dual. Moreover, the product comes in 8-soic (0.154", 3.90mm width). It comes in general purpose configuration. Has a maximum 225ns propagation delay. In addition, it is reach unaffected. Furthermore, it has apush-pull output. Typical CMRR, PSRR of 100db cmrr, 110db psrr. It is shipped in tape & reel (tr) package . The maximum input offset voltage of 0.2mv @ 5v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 6 weeks standard lead time. The product is available in surface mount configuration. 8-soic is the supplier device package value. It carries 2 elements. Moreover, it corresponds to lmv762, a base product number of the product. The product is designated with the ear99 code number.

pdf icon
Metal One Composition Update 17/Jul/2014(PCN Assembly/Origin)
pdf icon
SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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