Microchip Technology ZL30116GGG2V2

ZL30116GGG2V2 Microchip Technology
Microchip Technology

Product Information

Main Purpose:
SONET/SDH, Stratum
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Operating Temperature:
-40°C ~ 85°C
Package / Case:
100-FBGA
Input:
LVCMOS
Ratio - Input:Output:
11:13
REACH Status:
REACH Unaffected
Differential - Input:Output:
Yes/Yes
Frequency - Max:
622.08MHz
Manufacturer:
Microchip Technology
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Output:
LVCMOS, LVPECL
standardLeadTime:
21 Weeks
Number of Circuits:
1
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
100-CABGA (9x9)
Packaging:
Tray
Voltage - Supply:
2.97V ~ 3.63V
PLL:
Yes
Base Product Number:
ZL30116
ECCN:
EAR99
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is ZL30116GGG2V2. Basic Purpose: sonet/sdh, stratum. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 100-fbga. Its input values include lvcmos. The ratio between its input and output is 11:13. In addition, it is reach unaffected. The differential input and output values included: yes/yes. It maximum frequency is 622.08mhz. The microchip technology's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). Moreover, the product allow the output of lvcmos, lvpecl. It has a long 21 weeks standard lead time. It integrates 1 circuits. The product is available in surface mount configuration. 100-cabga (9x9) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 2.97v ~ 3.63v. PLL options: yes. Moreover, it corresponds to zl30116, a base product number of the product. The product is designated with the ear99 code number.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Bond Wire 08/Nov/2019(PCN Assembly/Origin)
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Marking Change 05/Apr/2019(PCN Design/Specification)
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Multiple Changes 05/Apr/2019(PCN Other)
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Packing Changes 07/Jul/2019(PCN Packaging)

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