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This is manufactured by Chip Quik Inc.. The manufacturer part number is DIP300-SOIC-08W. The product's diameters include 0.400" l x 0.400" w (10.16mm x 10.16mm). Features a proto board of dip to smd type. The accepted package includes dip. The product is rohs3 compliant. The product is made from highly stable and reliable fr4 epoxy glass. In addition, it is reach unaffected. Its typical moisture sensitivity level is 1 (unlimited). In addition, bulk is the available packaging type of the product. Moreover, the product is 0.050" (1.27mm). Moreover, 0.063" (1.60mm) is the given board thickness. It has a long 4 weeks standard lead time. The product carries possible position value of 8. The chip quik inc.'s product offers user-desired applications.
For more information please check the datasheets.
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