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IC Socket Adapters Available Online With Same-Day Delivery.

New items

1-2324271-8, TE Connectivity

These products are designed to mount the socket to the printed circuit board and protect the socket from damage. Accessories for IC and component sockets include heat sinks, internal circuit adaptors, covers, and hardware and are used with DIP, LGA, and PGA processor sockets in servers, higher performance computing, and workstations and desktop computers. TE Connectivitys (TE) new LGA 4189 socket and hardware are qualified to support next generation CPUs.

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New items

W9528RC, Winslow

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors 'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format. IC Sockets-Package Adaptics DIP A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

WA13067DQAETRC, Winslow

QFN to PGA Pin Adapters 'Adaptics' converting Quad-Flat No-Leads packages (QFN) to Pin Grid Array (PGA) format. Note Adapter contains no central GND pad. IC Sockets-Package Adaptics A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

W13046RC, Winslow

QFN to DIP Pin Adapters 'Adaptics' converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to Dual In Line Package (DIP) format. IC Sockets-Package Adaptics A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

W9535PRC, Winslow

DIP to SOIC Sockets Two piece Adaptics that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier. PCB: Epoxy Fibreglass FR4 Dimensions No. Pins DIP Pitch (in.) SOIC Pitch (in.) Winslow Part No. Stock No 14 0.3 0.237 W9534P 240-6595 16 0.3 0.237 W9535P 240-6602 18 0.3 0.237 W9539P 240-6618 20 0.3 0.237 W9540P 240-6624 28 0.6 0.375 W9547P 240-6646 IC Sockets-Package Adaptics DIP A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

ADA-QFN44, Seeit

Seeit DIP Socket Adapters A range of universal adaptors from Seeit designed to convert to DIP packages. ADA-SOIC16-150 : SOP8/14/16 to DIP16 ( 454-6803 ) ADA-QFN28 : MLF28/QFN28 to DIP28 ( 919-5536 ) ADA-SSOP28 : SSOP8/14/16/28 to DIP28 ( 919-5520 ) ADA-SO28-300 : SOP18/28 to DIP28 ( 509-6292 ) ADA-PLCC32-32 : PLCC32 to DIP28 / DIP32 ( 454-6819 ) ADA-PLCC32 : PLCC32 to DIP32 ( 919-5539 ) ADA-TQFP32 : TQFP32 to DIP32 ( 919-5532 ) ADA-TSOP32-14 : TSOP32 to DIP32 ( 509-6309 ) ADA-TSOP32-20 : TSOP32 to DIP32 ( 454-6831 ) ADA-QFN44 : MLF44/QFN44 to DIP44 ( 919-5545 ) ADA-PLCC44 : PLCC44 to DIP44 ( 454-6825 ) ADA-TSOP48-20 : TSOP32/40/48 to DIP48 ( 454-6847 ) Programming Adaptors

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New items

W9530RC, Winslow

SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors 'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format. IC Sockets-Package Adaptics DIP A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

W9502RC, Winslow

SOIC to DIP Sockets Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format. PCB: Epoxy Fibreglass FR4 Dimensions DIP Pitch (in.) SOIC Pitch (in.) PCB Dim. (in.) PCB Dim. (in.) Winslow Part No. Number of Pins L W 0.3 0.237 0.4 0.5 W9501 8 0.3 0.237 0.7 0.5 W9502 14 0.3 0.237 0.8 0.5 W9503 16 0.3 0.237 0.9 0.5 W9504 18 0.3 0.237 1.0 0.5 W9505 20 0.6 0.540 1.2 0.8 W9506 24 0.6 0.460 1.3 0.8 W9513 24 0.3 0.375 1.2 0.6 W9507 24 0.6 0.375 1.4 0.8 W9508 28 0.6 0.375 1.6 0.8 W9509 32 0.6 0.540 1.7 0.8 W9512 32 IC Sockets-Package Adaptics DIP A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

W9325-ZC158, Winslow

SMT PLCC Plugs Adaptic's Large Footprint Surface-mount (SMT) Plugs will mate with PLCC production sockets for connection of test equipment or daughter boards.

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New items

WA020127FSAJTRC, Winslow

PLCC to DIP Sockets Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages. IC Sockets-Package Adaptics DIP A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

W13090RC, Winslow

QFN to DIP Pin Adapters 'Adaptics' converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to Dual In Line Package (DIP) format. IC Sockets-Package Adaptics A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

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New items

ADA-QFN24, Seeit

Seeit The Seeit adapter connect the pins of a DFN24 or QFN24 (dimensions 4 x 4 mm) package chip to a 24 pin DIP equivalent and it accept a MLF, QFN device and plug into a DIP socket. Pitch up to 0.5 mm Pluggable adapter Socket type cover

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