Maximum Peak Pulse Current:
9.9A
Maximum Reverse Stand-off Voltage:
5V
Dimensions:
1 x 0.6 x 0.35mm
Mounting Type:
Surface Mount
Capacitance:
21pF
Maximum Reverse Leakage Current:
100nA
Maximum Operating Temperature:
+150 °C
Minimum Breakdown Voltage:
5.1V
Direction Type:
Bi-Directional
Height:
0.35mm
Width:
0.6mm
Length:
1mm
Package Type:
X2DFN
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
ESD Protection:
Yes
Maximum Clamping Voltage:
6V
Diode Configuration:
Single
Pin Count:
2
Test Current:
1mA
Voltage - Reverse Standoff (Typ):
5V (Max)
Base Part Number:
ESDM3051
Detailed Description:
8.2V Clamp 8A Ipp Tvs Diode Surface Mount 2-X2DFN (1x0.6)
Mounting Type:
Surface Mount
Voltage - Clamping (Max) @ Ipp:
8.2V
Supplier Device Package:
2-X2DFN (1x0.6)
Voltage - Breakdown (Min):
5.1V
Packaging:
Cut Tape (CT)
Applications:
USB
Operating Temperature:
-55°C ~ 150°C (TJ)
Capacitance @ Frequency:
21pF @ 1MHz (Max)
Customer Reference:
Package / Case:
0402 (1006 Metric)
Power Line Protection:
No
Bidirectional Channels:
1
Type:
Zener
Current - Peak Pulse (10/1000µs):
8A
Manufacturer:
ON Semiconductor
