Maximum Peak Pulse Current:
2.5A
Dimensions:
0.8 x 0.8 x 0.63mm
Mounting Type:
Surface Mount
ESD Protection:
Yes
Maximum Operating Temperature:
+85 °C
Maximum Reverse Leakage Current:
100nA
Minimum Breakdown Voltage:
6V
Peak Pulse Power Dissipation:
50W
Height:
0.63mm
Width:
0.8mm
Length:
0.8mm
Package Type:
WLCSP
Number of Elements per Chip:
3
Minimum Operating Temperature:
-40 °C
Diode Configuration:
Complex Array
Pin Count:
4
Manufacturer Standard Lead Time:
30 Weeks
Base Part Number:
ESD7383
Detailed Description:
10V Clamp 2.5A (8/20µs) Ipp Tvs Diode Surface Mount 4-WLCSP (0.8x0.8)
Mounting Type:
Surface Mount
Voltage - Clamping (Max) @ Ipp:
10V
Supplier Device Package:
4-WLCSP (0.8x0.8)
Voltage - Breakdown (Min):
6V
Unidirectional Channels:
3
Packaging:
Cut Tape (CT)
Applications:
USB OTG
Operating Temperature:
-40°C ~ 85°C (TJ)
Voltage - Reverse Standoff (Typ):
3V
Customer Reference:
Package / Case:
4-UFBGA, WLCSP
Power Line Protection:
Yes
Power - Peak Pulse:
50W
Type:
Steering (Rail to Rail)
Current - Peak Pulse (10/1000µs):
2.5A (8/20µs)
Manufacturer:
ON Semiconductor
