Toshiba Semiconductor and Storage DF2B5M4SL,L3F

DF2B5M4SL-L3F Toshiba Semiconductor and Storage DF2B5M4SL,L3F
Toshiba Semiconductor and Storage

Product Information

Voltage - Clamping (Max) @ Ipp:
24V
HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-
Package / Case:
2-SMD, No Lead
Type:
Zener
REACH Status:
REACH Unaffected
Voltage - Breakdown (Min):
4V
edacadModel:
DF2B5M4SL,L3F Models
Applications:
General Purpose
edacadModelUrl:
/en/models/5415954
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Bidirectional Channels:
1
standardLeadTime:
12 Weeks
Current - Peak Pulse (10/1000µs):
2A (8/20µs)
Voltage - Reverse Standoff (Typ):
3.6V (Max)
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
SL2
Packaging:
Tape & Reel (TR)
Capacitance @ Frequency:
0.2pF @ 1MHz
Power Line Protection:
No
Power - Peak Pulse:
30W
Base Product Number:
DF2B5
ECCN:
EAR99
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This is manufactured by Toshiba Semiconductor and Storage. The manufacturer part number is DF2B5M4SL,L3F. The maximum clamping voltage is 24v. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in 2-smd, no lead. It comes in zener configuration. In addition, it is reach unaffected. The minimum breakdown voltage is 4v. The product is widely employed in general purpose. Its typical moisture sensitivity level is 1 (unlimited). The product has 1 bidirectional channels. It has a long 12 weeks standard lead time. The peak pulse of the product is given as 2a (8/20µs). Provide with the typical reverse standoff voltage of 3.6v (max). The product is available in surface mount configuration. sl2 is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It has a nominal capacitance and frequency values of 0.2pf @ 1mhz. Power Line Protection: no. Furthermore, the peak pulse power of the product is 30w. Moreover, it corresponds to df2b5, a base product number of the product. The product is designated with the ear99 code number.

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