ON Semiconductor NTMS10P02R2G

ON Semiconductor

Product Information

Category:
Power MOSFET
Dimensions:
5 x 4 x 1.5mm
Maximum Continuous Drain Current:
6.4 A
Transistor Material:
Si
Width:
4mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
20 V
Maximum Gate Threshold Voltage:
1.2V
Package Type:
SOIC
Number of Elements per Chip:
1
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
48 nC @ 4.5 V
Channel Type:
P
Typical Input Capacitance @ Vds:
3100 pF @ -16 V
Length:
5mm
Pin Count:
8
Typical Turn-Off Delay Time:
110 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
2.5 W
Maximum Gate Source Voltage:
-12 V, +12 V
Height:
1.5mm
Typical Turn-On Delay Time:
25 ns
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
20 mΩ
Manufacturer Standard Lead Time:
51 Weeks
Detailed Description:
P-Channel 20V 8.8A (Ta) 1.6W (Ta) Surface Mount 8-SOIC
Vgs(th) (Max) @ Id:
1.2V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Base Part Number:
NTMS10
Gate Charge (Qg) (Max) @ Vgs:
70nC @ 4.5V
Rds On (Max) @ Id, Vgs:
14mOhm @ 10A, 4.5V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
3640pF @ 16V
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
8.8A (Ta)
Customer Reference:
Power Dissipation (Max):
1.6W (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is NTMS10P02R2G. It is of power mosfet category . The given dimensions of the product include 5 x 4 x 1.5mm. While 6.4 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 4mm wide. The product offers single transistor configuration. It has a maximum of 20 v drain source voltage. The product carries 1.2v of maximum gate threshold voltage. The package is a sort of soic. It consists of 1 elements per chip. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 48 nc @ 4.5 v. The product is available in [Cannel Type] channel. Its typical input capacitance @ Vds is 3100 pf @ -16 v . Its accurate length is 5mm. It contains 8 pins. Whereas, its typical turn-off delay time is about 110 ns . The product is available in surface mount configuration. The product carries enhancement channel mode. Provides up to 2.5 w maximum power dissipation. It features a maximum gate source voltage of -12 v, +12 v. In addition, the height is 1.5mm. In addition, it has a typical 25 ns turn-on delay time . Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 20 mω maximum drain source resistance. It has typical 51 weeks of manufacturer standard lead time. It features p-channel 20v 8.8a (ta) 1.6w (ta) surface mount 8-soic. The typical Vgs (th) (max) of the product is 1.2v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). Base Part Number: ntms10. The maximum gate charge and given voltages include 70nc @ 4.5v. It has a maximum Rds On and voltage of 14mohm @ 10a, 4.5v. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 2.5v, 4.5v. The on semiconductor's product offers user-desired applications. The product has a 20v drain to source voltage. The maximum Vgs rate is ±12v. The product's input capacitance at maximum includes 3640pf @ 16v. 8-soic is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 8.8a (ta). The product carries maximum power dissipation 1.6w (ta). This product use mosfet (metal oxide) technology.

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Datasheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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NTMS10P02R2(Datasheets)
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Multiple Devices Copper Wire 20/Aug/2008(PCN Design/Specification)
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Mult MSL1 Pkg Chg 20/Dec/2018(PCN Packaging)

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