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Texas Instruments LMC6061IMX/NOPB

LMC6061IMX-NOPB Texas Instruments LMC6061IMX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
0.01 pA
Voltage - Input Offset:
100 µV
Voltage - Supply Span (Max):
15.5 V
Voltage - Supply Span (Min):
4.5 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
LMC6061IMX/NOPB Models
Current - Supply:
24µA
edacadModelUrl:
/en/models/367398
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.035V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
1
Gain Bandwidth Product:
100 kHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
General Purpose
Base Product Number:
LMC6061
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMC6061IMX/NOPB. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 0.01 pa. The input offset voltage is 100 µv. The maximum voltage supply span of the product is 15.5 v. While the minimum voltage supply is 4.5 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 24µa. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 0.035v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 1 circuits. The gain bandwidth product is 100 khz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmc6061, a base product number of the product. The product is designated with the ear99 code number.

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Mult Devices Wafer Fab Site 09/Mar/2017(PCN Assembly/Origin)
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Mold Compound 24/Mar/2016(PCN Design/Specification)

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