Dimensions:
4.9 x 3.9 x 1.58mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
1.6 (Single) W, 2 (Dual) W
Height:
1.58mm
Width:
3.9mm
Length:
4.9mm
Package Type:
SOIC
Number of Elements per Chip:
2
Minimum Operating Temperature:
-55 °C
Maximum Operating Temperature:
+150 °C
Pin Count:
8
FET Feature:
Logic Level Gate
Base Part Number:
FDS89
Detailed Description:
Mosfet Array N and P-Channel 30V 7A, 5A 900mW Surface Mount 8-SOIC
Input Capacitance (Ciss) (Max) @ Vds:
575pF @ 15V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
3V @ 250µA
Series:
PowerTrench®
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Rds On (Max) @ Id, Vgs:
28mOhm @ 7A, 10V
Supplier Device Package:
8-SOIC
Manufacturer Standard Lead Time:
18 Weeks
Packaging:
Cut Tape (CT)
Gate Charge (Qg) (Max) @ Vgs:
16nC @ 10V
FET Type:
N and P-Channel
Customer Reference:
Power - Max:
900mW
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
7A, 5A
Manufacturer:
ON Semiconductor
