AMD XC7Z100-2FFG1156I
Product Information
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Peripherals:
DMA
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
RAM Size:
256KB
Primary Attributes:
Kintex™-7 FPGA, 444K Logic Cells
REACH Status:
REACH Unaffected
edacadModel:
XC7Z100-2FFG1156I Models
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
edacadModelUrl:
/en/models/5039559
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Architecture:
MCU, FPGA
Number of I/O:
250
standardLeadTime:
16 Weeks
Flash Size:
-
Series:
Zynq®-7000
Supplier Device Package:
1156-FCBGA (35x35)
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed:
800MHz
Base Product Number:
XC7Z100
ECCN:
3A991D
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Yes. We ship XC7Z100-2FFG1156I Internationally to many countries around the world.
This is manufactured by AMD. The manufacturer part number is XC7Z100-2FFG1156I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. It has supplied with other peripherals, such as dma. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 1156-bbga, fcbga. The product has typical 256kb RAM size. Primary Attributes of the Product: kintex™-7 fpga, 444k logic cells. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ebi/emi, ethernet, i2c, mmc/sd/sdio, spi, uart/usart, usb otg. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). The product has been designed as mcu, fpga. 250 is the I/O value of the product. It has a long 16 weeks standard lead time. The product zynq®-7000, is a highly preferred choice for users. 1156-fcbga (35x35) is the supplier device package value. dual arm® cortex®-a9 mpcore™ with coresight™ is the product's core processor. It has a robust speed of 800mhz. Moreover, it corresponds to xc7z100, a base product number of the product. The product is designated with the 3a991d code number.
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