AMD Xilinx XCZU46DR-L2FFVH1760I
Product Information
Number of I/O:
574
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
RAM Size:
256KB
Peripherals:
DDR, DMA, PCIe
Primary Attributes:
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Architecture:
MCU, FPGA
standardLeadTime:
35 Weeks
Flash Size:
-
Series:
Zynq® UltraScale+™ RFSoC
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed:
533MHz, 1.333GHz
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Yes. Our products in System On Chip (SoC) category are shipped in lowest possible time.
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Yes. We ship XCZU46DR-L2FFVH1760I Internationally to many countries around the world.
This is manufactured by AMD Xilinx. The manufacturer part number is XCZU46DR-L2FFVH1760I. 574 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 1760-bbga, fcbga. The product has typical 256kb RAM size. It has supplied with other peripherals, such as ddr, dma, pcie. Primary Attributes of the Product: zynq®ultrascale+™ fpga, 930k+ logic cells. It provides connectivity solutions through canbus, ebi/emi, ethernet, i²c, mmc/sd/sdio, spi, uart/usart, usb otg. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). The product has been designed as mcu, fpga. It has a long 35 weeks standard lead time. The product zynq® ultrascale+™ rfsoc, is a highly preferred choice for users. 1760-fcbga (42.5x42.5) is the supplier device package value. quad arm® cortex®-a53 mpcore™ with coresight™, dual arm®cortex™-r5 with coresight™ is the product's core processor. It has a robust speed of 533mhz, 1.333ghz.
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