Microchip Technology M2S050-FCSG325I

M2S050-FCSG325I Microchip Technology
Microchip Technology

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
200
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
325-TFBGA, FCBGA
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Primary Attributes:
FPGA - 50K Logic Modules
REACH Status:
REACH Unaffected
Connectivity:
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
standardLeadTime:
16 Weeks
Flash Size:
256KB
Series:
SmartFusion®2
Supplier Device Package:
325-FCBGA (11x11)
Core Processor:
ARM® Cortex®-M3
Speed:
166MHz
Base Product Number:
M2S050
ECCN:
3A991D
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This is manufactured by Microchip Technology. The manufacturer part number is M2S050-FCSG325I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 200 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 325-tfbga, fcbga. The product has typical 64kb RAM size. It has supplied with other peripherals, such as ddr, pcie, serdes. Primary Attributes of the Product: fpga - 50k logic modules. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ethernet, i2c, spi, uart/usart, usb. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. It has a long 16 weeks standard lead time. The product has 256kb flash size. The product smartfusion®2, is a highly preferred choice for users. 325-fcbga (11x11) is the supplier device package value. arm® cortex®-m3 is the product's core processor. It has a robust speed of 166mhz. Moreover, it corresponds to m2s050, a base product number of the product. The product is designated with the 3a991d code number.

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Software 19/Apr/2023(PCN Obsolescence/ EOL)
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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Manufacturing Change 23/Feb/2021(PCN Assembly/Origin)
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Software 19/Apr/2023(PCN Design/Specification)
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Software 20/Apr/2023(PCN Design/Specification)
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WD_TIMEOUT 13/Aug/2019(PCN Other)

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