Microchip Technology M2S010-FGG484
Product Information
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Peripherals:
DDR, PCIe, SERDES
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
RAM Size:
64KB
Primary Attributes:
FPGA - 10K Logic Modules
REACH Status:
REACH Unaffected
edacadModel:
M2S010-FGG484 Models
Connectivity:
CANbus, Ethernet, I2C, SPI, UART/USART, USB
edacadModelUrl:
/en/models/4294198
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
Number of I/O:
233
standardLeadTime:
10 Weeks
Flash Size:
256KB
Series:
SmartFusion®2
Supplier Device Package:
484-FPBGA (23x23)
Core Processor:
ARM® Cortex®-M3
Speed:
166MHz
Base Product Number:
M2S010
ECCN:
3A991D
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Yes. We ship M2S010-FGG484 Internationally to many countries around the world.
This is manufactured by Microchip Technology. The manufacturer part number is M2S010-FGG484. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. It has supplied with other peripherals, such as ddr, pcie, serdes. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 484-bga. The product has typical 64kb RAM size. Primary Attributes of the Product: fpga - 10k logic modules. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ethernet, i2c, spi, uart/usart, usb. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. 233 is the I/O value of the product. It has a long 10 weeks standard lead time. The product has 256kb flash size. The product smartfusion®2, is a highly preferred choice for users. 484-fpbga (23x23) is the supplier device package value. arm® cortex®-m3 is the product's core processor. It has a robust speed of 166mhz. Moreover, it corresponds to m2s010, a base product number of the product. The product is designated with the 3a991d code number.
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