Microchip Technology A2F200M3F-FGG256I
Product Information
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
MCU - 25, FPGA - 66
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
RAM Size:
64KB
Peripherals:
DMA, POR, WDT
Primary Attributes:
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
REACH Status:
REACH Unaffected
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
MCU, FPGA
standardLeadTime:
16 Weeks
Flash Size:
256KB
Series:
SmartFusion®
Supplier Device Package:
256-FPBGA (17x17)
Core Processor:
ARM® Cortex®-M3
Speed:
80MHz
Base Product Number:
A2F200
ECCN:
3A991D
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This is manufactured by Microchip Technology. The manufacturer part number is A2F200M3F-FGG256I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. mcu - 25, fpga - 66 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 256-lbga. The product has typical 64kb RAM size. It has supplied with other peripherals, such as dma, por, wdt. Primary Attributes of the Product: proasic®3 fpga, 200k gates, 4608 d-flip-flops. In addition, it is reach unaffected. It provides connectivity solutions through ebi/emi, ethernet, i2c, spi, uart/usart. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as mcu, fpga. It has a long 16 weeks standard lead time. The product has 256kb flash size. The product smartfusion®, is a highly preferred choice for users. 256-fpbga (17x17) is the supplier device package value. arm® cortex®-m3 is the product's core processor. It has a robust speed of 80mhz. Moreover, it corresponds to a2f200, a base product number of the product. The product is designated with the 3a991d code number.
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