NXP USA Inc. PMEG2005EPK,315

PMEG2005EPK-315 NXP USA Inc. PMEG2005EPK,315
NXP USA Inc.

Product Information

HTSUS:
8541.10.0070
Package / Case:
2-XDFN
Operating Temperature - Junction:
150°C (Max)
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
3 ns
Current - Average Rectified (Io):
500mA
Voltage - Forward (Vf) (Max) @ If:
410 mV @ 500 mA
Voltage - DC Reverse (Vr) (Max):
20 V
Capacitance @ Vr, F:
35pF @ 1V, 1MHz
Current - Reverse Leakage @ Vr:
130 µA @ 10 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
DFN1608D-2
Packaging:
Bulk
Technology:
Schottky
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is PMEG2005EPK,315. It is assigned with possible HTSUS value of 8541.10.0070. Moreover, the product comes in 2-xdfn. The product operate at temperatures ranging from 150°c (max). It has a robust speed of fast recovery =< 500ns, > 200ma (io). It has a trr (reverse recovery time) of 3 ns. It features a 500ma of average rectified current. The product has a maximum forward voltage of 410 mv @ 500 ma. While it has maximum reverse voltage of 20 v. Moreover, the product has a 35pf @ 1v, 1mhz capacitance. 130 µa @ 10 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. dfn1608d-2 is the supplier device package value. In addition, bulk is the available packaging type of the product. This product use schottky technology. The product is designated with the ear99 code number.

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