STMicroelectronics STPST1H100ZF
Product Information
HTSUS:
8541.10.0080
Package / Case:
SOD-123F
Operating Temperature - Junction:
175°C
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Current - Average Rectified (Io):
1A
Voltage - Forward (Vf) (Max) @ If:
725 mV @ 1 A
Package:
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max):
100 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
19 Weeks
Current - Reverse Leakage @ Vr:
1.7 µA @ 100 V
Mounting Type:
Surface Mount
Series:
ECOPACK®2
Supplier Device Package:
SOD-123F
Technology:
Schottky
Base Product Number:
STPST1
ECCN:
EAR99
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FAQs
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We use our internationally recognized delivery partners UPS/DHL. Collection of ET24958811 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "STMicroelectronics" products on our website by using Enrgtech's Unique Manufacturing Part Number ET24958811.
Yes. We ship STPST1H100ZF Internationally to many countries around the world.
This is manufactured by STMicroelectronics. The manufacturer part number is STPST1H100ZF. It is assigned with possible HTSUS value of 8541.10.0080. Moreover, the product comes in sod-123f. The product operate at temperatures ranging from 175°c. It has a robust speed of fast recovery =< 500ns, > 200ma (io). It features a 1a of average rectified current. The product has a maximum forward voltage of 725 mv @ 1 a. It is shipped in tape & reel (tr) package . While it has maximum reverse voltage of 100 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 19 weeks standard lead time. 1.7 µa @ 100 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. The product ecopack®2, is a highly preferred choice for users. sod-123f is the supplier device package value. This product use schottky technology. Moreover, it corresponds to stpst1, a base product number of the product. The product is designated with the ear99 code number.
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