ON Semiconductor FSA1257L8X

FSA1257L8X ON Semiconductor
ON Semiconductor

Product Information

Manufacturer Standard Lead Time:
20 Weeks
Detailed Description:
2 Circuit IC Switch 1:1 1.15Ohm 8-MicroPak™
-3db Bandwidth:
300MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Channel-to-Channel Matching (ΔRon):
60mOhm
Package / Case:
8-UFQFN
Switch Time (Ton, Toff) (Max):
35ns, 15ns
Current - Leakage (IS(off)) (Max):
2nA (Typ)
Base Part Number:
FSA12
Multiplexer/Demultiplexer Circuit:
1:1
Manufacturer:
ON Semiconductor
Channel Capacitance (CS(off), CD(off)):
11.5pF
Voltage - Supply, Single (V+):
1.65V ~ 5.5V
Switch Circuit:
SPST - NC
Number of Circuits:
2
Mounting Type:
Surface Mount
Crosstalk:
-100dB @ 1MHz
On-State Resistance (Max):
1.15Ohm
Supplier Device Package:
8-MicroPak™
Charge Injection:
20pC
Packaging:
Cut Tape (CT)
Customer Reference:
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FSA1257L8X. It has typical 20 weeks of manufacturer standard lead time. It features 2 circuit ic switch 1:1 1.15ohm 8-micropak™. A 300mhz of bandwidth. The product has -40°c ~ 85°c (ta) operating temperature range. Features 60mohm of channel-to-channel matching. Moreover, the product comes in 8-ufqfn. Has a 35ns, 15ns maximum switch time. The maximum current leakage of the product included 2na (typ). Base Part Number: fsa12. Ratio of multiplexer/demultiplexer circuit 1:1. The on semiconductor's product offers user-desired applications. Features 11.5pf channel capacitance. Single voltage supply of 1.65v ~ 5.5v. Features switch circuit of spst - nc. It integrates 2 circuits. The product is available in surface mount configuration. A -100db @ 1mhz of crosstalk. It has a maximum on-state resistance of 1.15ohm. 8-micropak™ is the supplier device package value. It has 20pc charge injection parameters. In addition, cut tape (ct) is the available packaging type of the product.

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Qualify 2nd supplier 13/Aug/2020(PCN Assembly/Origin)
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Logo 17/Aug/2017(PCN Design/Specification)
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Die Material, Mold Compound 03/Oct/2008(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)

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FAQs

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