Contact Finish - Mating:
Gold
Style:
Board to Board
Contact Finish - Post:
Tin
HTSUS:
8536.69.4040
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-55°C ~ 125°C
Contact Finish Thickness - Post:
-
Number of Positions:
80
title:
1061586
Insulation Height:
0.309" (7.85mm)
Insulation Color:
Black
REACH Status:
REACH Unaffected
edacadModel:
1061586 Models
Applications:
-
Number of Rows:
2
Material Flammability Rating:
UL94 V-0
edacadModelUrl:
/en/models/22202926
Contact Shape:
Rectangular
Contact Finish Thickness - Mating:
-
Voltage Rating:
500VAC
Row Spacing - Mating:
0.056" (1.42mm)
Connector Type:
Receptacle
Number of Positions Loaded:
All
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Fastening Type:
Push-Pull
Termination:
Solder
standardLeadTime:
16 Weeks
Current Rating (Amps):
1.7A
Contact Length - Post:
-
Pitch - Mating:
0.031" (0.80mm)
Ingress Protection:
-
Features:
Board Guide, Solder Retention
Mounting Type:
Surface Mount
Series:
COMBICON FP
Packaging:
Tape & Reel (TR)
Mated Stacking Heights:
-
Contact Type:
Female Socket
Contact Material:
Copper Alloy
Insulation Material:
Liquid Crystal Polymer (LCP)
ECCN:
EAR99
Sub Type:
SMD Female Connector
Row Pitch:
0.8mm
Current:
1.7A
Connector System:
ScaleX
Number of Rows:
2
Contact Plating:
Gold
Product Type:
PCB Socket
Maximum Operating Temperature:
125°C
Termination Type:
Solder
Contact Gender:
Female
Standards/Approvals:
cULus Recognised, DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07, IEC 60112, IEC 60512-5-2:2002-02, UL 94 V0, IEC 60512-3-1:2002-02, IEC 60512-4-1:2003-05
Mount Type:
Surface
Housing Material:
Liquid Crystal Polymer
Orientation:
Right Angle
Stacking Height:
7.85mm
Series:
FP
Voltage:
500 V
Minimum Operating Temperature:
-55°C
Pitch:
0.8mm
Number of Contacts:
80
Contact Material:
Copper Alloy
