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AMD XC7V2000T-1FLG1925CES9937

XC7V2000T-1FLG1925CES9937 AMD
AMD

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Number of I/O:
1200
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Number of Logic Elements/Cells:
1954560
REACH Status:
REACH Unaffected
Total RAM Bits:
47628288
edacadModelUrl:
/en/models/3585744
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Number of LABs/CLBs:
152700
Mounting Type:
Surface Mount
Series:
Virtex®-7 T
Supplier Device Package:
1925-FCBGA (45x45)
Voltage - Supply:
0.97V ~ 1.03V
ECCN:
3A001A7A
Base Product Number:
XC7V2000T
edacadModel:
XC7V2000T-1FLG1925CES9937 Models
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This is manufactured by AMD. The manufacturer part number is XC7V2000T-1FLG1925CES9937. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 1200 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 1924-bbga, fcbga. The product contains 1954560 logic cells/elements. In addition, it is reach unaffected. It include a total of 47628288 RAM bits. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). It consists of 152700 CLBs/LABs. The product is available in surface mount configuration. The product virtex®-7 t, is a highly preferred choice for users. 1925-fcbga (45x45) is the supplier device package value. It has optimum voltage supply of 0.97v ~ 1.03v. The product is designated with the 3a001a7a code number. Moreover, it corresponds to xc7v2000t, a base product number of the product.

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Virtex-7 FPGAs Brief(Datasheets)
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Xilinx REACH211 Cert(Environmental Information)

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We use our internationally recognized delivery partners UPS/DHL. Collection of ET24437803 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "AMD" products on our website by using Enrgtech's Unique Manufacturing Part Number ET24437803.
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