Intel 10M50DAF256I7G

10M50DAF256I7G Intel
Intel

Product Information

HTSUS:
8542.39.0001
RoHS Status:
RoHS Compliant
Package / Case:
256-LBGA
Number of I/O:
178
Operating Temperature:
-40°C ~ 100°C (TJ)
DigiKey Programmable:
Not Verified
REACH Status:
REACH Unaffected
edacadModel:
10M50DAF256I7G Models
edacadModelUrl:
/en/models/5283267
Number of Logic Elements/Cells:
50000
Moisture Sensitivity Level (MSL):
3 (168 Hours)
standardLeadTime:
16 Weeks
Total RAM Bits:
1677312
Number of LABs/CLBs:
3125
Mounting Type:
Surface Mount
Series:
MAX® 10
Supplier Device Package:
256-FBGA (17x17)
Packaging:
Tray
Voltage - Supply:
1.15V ~ 1.25V
ECCN:
3A991D
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This is manufactured by Intel. The manufacturer part number is 10M50DAF256I7G. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs compliant. Moreover, the product comes in 256-lbga. 178 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. In addition, it is reach unaffected. The product contains 50000 logic cells/elements. Its typical moisture sensitivity level is 3 (168 hours). It has a long 16 weeks standard lead time. It include a total of 1677312 RAM bits. It consists of 3125 CLBs/LABs. The product is available in surface mount configuration. The product max® 10, is a highly preferred choice for users. 256-fbga (17x17) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 1.15v ~ 1.25v. The product is designated with the 3a991d code number.

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MAX 10 User Guide(Product Brief)
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Mult PN LABEL 01/08/2023(PCN Design/Specification)
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Max10 Pin Guide 3/Dec/2021(PCN Design/Specification)
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Intel® MAX® 10 FPGA Device Overview(Datasheets)
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Intel® MAX® 10 FPGA Device Datasheet(Datasheets)
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Mult Dev Label Chgs 24/Feb/2020(PCN Packaging)
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Mult Dev Label Chgs 15/Apr/2024(PCN Packaging)

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FAQs

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