Xilinx Inc. XC7Z045-3FFV900E
Product Information
Detailed Description:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 900-FCBGA (31x31)
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Series:
Zynq®-7000
Customer Reference:
Number of I/O:
128
Supplier Device Package:
900-FCBGA (31x31)
Packaging:
Tray
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
900-BBGA, FCBGA
Peripherals:
DMA
RAM Size:
256KB
Speed:
800MHz
Manufacturer:
Xilinx Inc.
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This is manufactured by Xilinx Inc.. The manufacturer part number is XC7Z045-3FFV900E. It features dual arm® cortex®-a9 mpcore™ with coresight™ system on chip (soc) ic zynq®-7000 kintex™-7 fpga, 350k logic cells 800mhz 900-fcbga (31x31). dual arm® cortex®-a9 mpcore™ with coresight™ is the product's core processor. Primary Attributes of the Product: kintex™-7 fpga, 350k logic cells. The product zynq®-7000, is a highly preferred choice for users. 128 is the I/O value of the product. 900-fcbga (31x31) is the supplier device package value. In addition, tray is the available packaging type of the product. It provides connectivity solutions through canbus, ebi/emi, ethernet, i²c, mmc/sd/sdio, spi, uart/usart, usb otg. The product has 0°c ~ 100°c (tj) operating temperature range. The product has been designed as mcu, fpga. Moreover, the product comes in 900-bbga, fcbga. It has supplied with other peripherals, such as dma. The product has typical 256kb RAM size. It has a robust speed of 800mhz. The xilinx inc.'s product offers user-desired applications.
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