Texas Instruments LM4890MX/NOPB

LM4890MX-NOPB Texas Instruments LM4890MX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C (TA)
Max Output Power x Channels @ Load:
1W x 1 @ 8Ohm
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Type:
Class AB
title:
LM4890MX/NOPB
REACH Status:
REACH Unaffected
Output Type:
1-Channel (Mono)
edacadModel:
LM4890MX/NOPB Models
edacadModelUrl:
/en/models/355400
Manufacturer:
Texas Instruments
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
6 Weeks
Features:
Depop, Shutdown, Thermal Protection
Mounting Type:
Surface Mount
Series:
Boomer®
Supplier Device Package:
8-SOIC
Packaging:
Tape & Reel (TR)
Voltage - Supply:
2.2V ~ 5.5V
Base Product Number:
LM4890
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM4890MX/NOPB. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c (ta) operating temperature range. It has a maximum output power into channels at given loads, such as 1w x 1 @ 8ohm. Moreover, the product comes in 8-soic (0.154", 3.90mm width). It comes in class ab configuration. In addition, it is reach unaffected. Furthermore, it has a1-channel (mono) output. The texas instruments's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). It has a long 6 weeks standard lead time. The splendid features of the product include depop, shutdown, thermal protection. The product is available in surface mount configuration. The product boomer®, is a highly preferred choice for users. 8-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It has optimum voltage supply of 2.2v ~ 5.5v. Moreover, it corresponds to lm4890, a base product number of the product. The product is designated with the ear99 code number.

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SOIC Pkg Wire Bonding Update 24/Jul/2013(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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