MG Chemical Epoxy Thermal Conductive Adhesive, 80 min @ +80 °C Cure, 25 ml Syringe

Enrgtech Part No: ET17974568
|
Manufacturer Part No:
8329TFS-25ML
|
Manufacturer: MG Chemical

8329TFS-25ML MG Chemical Epoxy Thermal Conductive Adhesive, 80 min @ +80 °C Cure, 25 ml Syringe

Product Information

Trade Name:

8329 TFS

Cure Time:

24 h

Operating Temperature Range:

-40 → +150 °C

Product Form:

Liquid

Viscosity Measurement:

700000cP/s

Viscosity Description:

Thixotropic

Application:

Thermal Management

Specific Gravity:

2.2

Package Type:

Dual Cartridge

Adhesive Type:

Thermal Adhesive

Minimum Operating Temperature:

-40°C

Package Size:

25 ml

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The MG Chemicals 8329TFS-25ML is a two-part, heat-cure epoxy adhesive formulated for high-performance thermal management in electronic assemblies. Delivered in a 25 mL dual-syringe package for easy mixing, it provides a long working time of approximately 4 hours and requires an 80-minute cure cycle at +80 °C for complete polymerisation. This adhesive is ideal for bonding heat sinks, LEDs, power modules, and other high-heat components in demanding industrial or commercial applications.

Unmatched Advantages of Buying the MG Chemical Epoxy Thermal Conductive Adhesive

Thermal conductivity approx. 1.2 W/(m·K) for efficient heat transfer.
Long 4-hour working (pot) time enables precise placement.
Cure option: 80 minutes @ 80 °C ensures reliable bonded joints.
1:1 mix ratio simplifies dispensing and reduces errors.
Strong electrical insulation – safe for high-voltage electronics.
Dark grey, low-flowable thixotropic paste suitable for syringes.

Engineered for High-Reliability Thermal Management

This epoxy adhesive is optimised for bonding in heat-generating electronic systems where efficient thermal path management is critical. Its strong compressive strength and compatibility with a wide variety of substrates make it suitable for durable attachment of heatsinks, LED arrays, power semiconductors, and compact modules. The long working time allows assembly teams to align components precisely before cure, while the electrical insulation characteristic ensures safe operation adjacent to high-voltage circuitry.

Wide Application Range

Bonding heatsinks to CPUs, power transistors, and LED modules.
Thermal adhesive for power-supply modules and converters.
Attaching sensors or modules to the chassis for improved heat dissipation.
Assembly of compact electronics.
Industrial electronics, instrumentation, EV chargers, telecom equipment.

Datasheet(Technical Reference)

Thermally Conductive Epoxy Adhesive (EN - SDS)(Technical Reference)

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You can order MG Chemical brand products with 8329TFS-25ML directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.

Yes. Our products in Adhesives category are shipped in lowest possible time.

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