The TE Connectivity Emboss tape memory socket is engineered for excellence in performance and reliability. Designed specifically for high-speed memory applications, this socket accommodates 204 positions while ensuring a right-angle module orientation, which facilitates a compact assembly. With a stack height of 9.2 mm, it seamlessly fits into space-constrained environments. The robust construction features durable materials, including high-temperature thermoplastic housing and stainless steel latch components, ensuring long-lasting functionality under diverse conditions. Additionally, this model adheres to key industry standards, boasting compliance with EU RoHS and REACH regulations, ensuring that it meets the rigorous demands of todays electronic market. By integrating this socket into your technology, you gain a dependable partner that supports optimal data processing capabilities.
High-performance memory support for DDR3 standards
Right-angle module orientation enhances installation flexibility
Stainless steel latch offers secure retention for memory modules
High-temperature thermoplastic housing withstands extreme conditions
Gold-plated contacts ensure superior electrical conductivity
Designed for seamless PCB surface mounting integration
Low halogen materials contribute to environmentally conscious manufacturing
Each unit is packaged to ensure efficient handling and volume management
