ON Semiconductor NTMS5P02R2SG

ON Semiconductor

Product Information

Base Part Number:
NTMS5P
Detailed Description:
P-Channel 20V 3.95A (Ta) 790mW (Ta) Surface Mount 8-SOIC
Input Capacitance (Ciss) (Max) @ Vds:
1900pF @ 16V
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1.25V @ 250µA
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±10V
Gate Charge (Qg) (Max) @ Vgs:
35nC @ 4.5V
Rds On (Max) @ Id, Vgs:
33mOhm @ 5.4A, 4.5V
Supplier Device Package:
8-SOIC
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
P-Channel
Customer Reference:
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Power Dissipation (Max):
790mW (Ta)
Current - Continuous Drain (Id) @ 25°C:
3.95A (Ta)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
ON Semiconductor
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This is manufactured by ON Semiconductor. The manufacturer part number is NTMS5P02R2SG. Base Part Number: ntms5p. It features p-channel 20v 3.95a (ta) 790mw (ta) surface mount 8-soic. The product's input capacitance at maximum includes 1900pf @ 16v. The drive voltage (maximum and minimum Rds On) of the product includes 2.5v, 4.5v. The product is available in surface mount configuration. The typical Vgs (th) (max) of the product is 1.25v @ 250µa. The product has a 20v drain to source voltage. The maximum Vgs rate is ±10v. The maximum gate charge and given voltages include 35nc @ 4.5v. It has a maximum Rds On and voltage of 33mohm @ 5.4a, 4.5v. 8-soic is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type p-channel. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The product carries maximum power dissipation 790mw (ta). The continuous current drain at 25°C is 3.95a (ta). This product use mosfet (metal oxide) technology. The on semiconductor's product offers user-desired applications.

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Multiple Devices 21/Jan/2010(PCN Obsolescence/ EOL)
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NTMS5P02R2(Datasheets)
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Multiple Devices Copper Wire 20/Aug/2008(PCN Design/Specification)

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