ON Semiconductor NDB6020P

ON Semiconductor

Product Information

Dimensions:
10.67 x 4.83 x 11.33mm
Maximum Continuous Drain Current:
24 A
Transistor Material:
Si
Width:
4.83mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
20 V
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
0.4V
Maximum Operating Temperature:
+175 °C
Typical Gate Charge @ Vgs:
25 nC @ 5 V
Channel Type:
P
Typical Input Capacitance @ Vds:
1590 pF@ -10 V
Length:
10.67mm
Pin Count:
3
Typical Turn-Off Delay Time:
120 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
60 W
Maximum Gate Source Voltage:
-8 V, +8 V
Height:
11.33mm
Typical Turn-On Delay Time:
15 ns
Minimum Operating Temperature:
-65 °C
Maximum Drain Source Resistance:
80 mΩ
Base Part Number:
NDB602
Detailed Description:
P-Channel 20V 24A (Tc) 60W (Tc) Surface Mount D²PAK (TO-263AB)
Input Capacitance (Ciss) (Max) @ Vds:
1590pF @ 10V
Drive Voltage (Max Rds On, Min Rds On):
4.5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1V @ 250µA
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±8V
Gate Charge (Qg) (Max) @ Vgs:
35nC @ 5V
Rds On (Max) @ Id, Vgs:
50mOhm @ 12A, 4.5V
Supplier Device Package:
D²PAK (TO-263AB)
Packaging:
Cut Tape (CT)
Operating Temperature:
-65°C ~ 175°C (TJ)
FET Type:
P-Channel
Customer Reference:
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Power Dissipation (Max):
60W (Tc)
Current - Continuous Drain (Id) @ 25°C:
24A (Tc)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
ON Semiconductor
RoHs Compliant
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This is manufactured by ON Semiconductor. The manufacturer part number is NDB6020P. The given dimensions of the product include 10.67 x 4.83 x 11.33mm. While 24 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 4.83mm wide. The product offers single transistor configuration. It has a maximum of 20 v drain source voltage. The package is a sort of d2pak (to-263). It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 0.4v. It has a maximum operating temperature of +175 °c. With a typical gate charge at Vgs includes 25 nc @ 5 v. The product is available in [Cannel Type] channel. Its typical input capacitance @ Vds is 1590 pf@ -10 v . Its accurate length is 10.67mm. It contains 3 pins. Whereas, its typical turn-off delay time is about 120 ns . The product is available in surface mount configuration. The product carries enhancement channel mode. Provides up to 60 w maximum power dissipation. It features a maximum gate source voltage of -8 v, +8 v. In addition, the height is 11.33mm. In addition, it has a typical 15 ns turn-on delay time . Whereas, the minimum operating temperature of the product is -65 °c. It provides up to 80 mω maximum drain source resistance. Base Part Number: ndb602. It features p-channel 20v 24a (tc) 60w (tc) surface mount d²pak (to-263ab). The product's input capacitance at maximum includes 1590pf @ 10v. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v. The typical Vgs (th) (max) of the product is 1v @ 250µa. The product has a 20v drain to source voltage. The maximum Vgs rate is ±8v. The maximum gate charge and given voltages include 35nc @ 5v. It has a maximum Rds On and voltage of 50mohm @ 12a, 4.5v. d²pak (to-263ab) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product has -65°c ~ 175°c (tj) operating temperature range. It carries FET type p-channel. Moreover, the product comes in to-263-3, d²pak (2 leads + tab), to-263ab. The product carries maximum power dissipation 60w (tc). The continuous current drain at 25°C is 24a (tc). This product use mosfet (metal oxide) technology. The on semiconductor's product offers user-desired applications.

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NDP6020P / NDB6020P, P-Channel Logic Level Enhancement Mode Field Effect Transistor Data Sheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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1Q2018 Product EOL 31/Mar/2018(PCN Obsolescence/ EOL)
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Description Chg 01/Apr/2016(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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TO263 Dev Pkg Chg 24/May/2018(PCN Packaging)
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TO263 31/Aug/2016(PCN Packaging)

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