ON Semiconductor FDS6294

ON Semiconductor

Product Information

Category:
Power MOSFET
Dimensions:
5 x 4 x 1.5mm
Maximum Continuous Drain Current:
13 A
Transistor Material:
Si
Width:
4mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
30 V
Package Type:
SOIC
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1V
Maximum Operating Temperature:
+175 °C
Typical Gate Charge @ Vgs:
10 nC @ 5 V
Channel Type:
N
Typical Input Capacitance @ Vds:
1205 pF @ 15 V
Length:
5mm
Pin Count:
8
Typical Turn-Off Delay Time:
24 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
3 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
1.5mm
Typical Turn-On Delay Time:
9 ns
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
11 mΩ
Detailed Description:
N-Channel 30V 13A (Ta) 3W (Ta) Surface Mount 8-SOIC
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Base Part Number:
FDS62
Gate Charge (Qg) (Max) @ Vgs:
14nC @ 5V
Rds On (Max) @ Id, Vgs:
11.3mOhm @ 13A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
30V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1205pF @ 15V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
8-SOIC
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
13A (Ta)
Customer Reference:
Power Dissipation (Max):
3W (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
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This is manufactured by ON Semiconductor. The manufacturer part number is FDS6294. It is of power mosfet category . The given dimensions of the product include 5 x 4 x 1.5mm. While 13 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 4mm wide. The product offers single transistor configuration. It has a maximum of 30 v drain source voltage. The package is a sort of soic. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 1v. It has a maximum operating temperature of +175 °c. With a typical gate charge at Vgs includes 10 nc @ 5 v. The product is available in [Cannel Type] channel. Its typical input capacitance @ Vds is 1205 pf @ 15 v . Its accurate length is 5mm. It contains 8 pins. Whereas, its typical turn-off delay time is about 24 ns . The product is available in surface mount configuration. The product carries enhancement channel mode. Provides up to 3 w maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -20 v, +20 v. In addition, the height is 1.5mm. In addition, it has a typical 9 ns turn-on delay time . Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 11 mω maximum drain source resistance. It features n-channel 30v 13a (ta) 3w (ta) surface mount 8-soic. The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 175°c (tj) operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). Base Part Number: fds62. The maximum gate charge and given voltages include 14nc @ 5v. It has a maximum Rds On and voltage of 11.3mohm @ 13a, 10v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The on semiconductor's product offers user-desired applications. The product has a 30v drain to source voltage. The maximum Vgs rate is ±20v. The product's input capacitance at maximum includes 1205pf @ 15v. The product powertrench®, is a highly preferred choice for users. 8-soic is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 13a (ta). The product carries maximum power dissipation 3w (ta). This product use mosfet (metal oxide) technology.

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Trans MOSFET N-CH 30V 13A 8-Pin SOIC(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Mult Dev EOL 12/Aug/2020(PCN Obsolescence/ EOL)
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FDS6294(Datasheets)
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Mold Compound 12/Dec/2007(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)
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Mult MSL1 Pkg Chg 20/Dec/2018(PCN Packaging)

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